Global Engineering Services (GES) offers well-rounded product design expertise in multiple industries, from networking to storage, computer systems and servers to medical devices, consumer electronics to defense systems.
GES can help you design the product from cradle to product rollout, including architectural definition, block diagram, board design and schematics, Signal Integrity, PCB layout, and board bring-up for reference boards and system-level design requirements.
GES can help you with all your electronic product design needs including the customization and productization of reference design boards while utilizing our years of experience. We will ensure that our design meets your DFM, DFA, DFT, time-to-market and unit cost requirements.
Component Engineering, PCB Layout, Design for Manufacturing, Design for Test, New Product Introduction (NPI), Power, Thermal, Mechanical Design, 3D Modeling, Firmware and Software Development; we have it all in-house.
We offer very comprehensive design and engineering services including designing characterization boards for new silicon, developing test plan and providing characterization services, designing and manufacturing reference design boards, custom hardware development, boards and system level products with custom chassis and heat management systems.
There are four significant advantages that GES offers, with an extremely successful track record:
• We have years of successful experience in serving very diversified market segments. In each industry, we have successfully provided our
services. For every design, our customer benefit from our in-depth, years of aggregated experience across multiple industries.
• We have successfully integrated all critical expertise in-house, and have a great process to orchestrate all cross functional teams in parallel
to ensure faster and better product designs. With all teams in-house (Design, SI, Layout, Mechanical, Thermal and Operations), we minimize
handoffs,which significantly reduces customers schedule and quality risk with multiple handoffs.
• We understand the connectivity and SI challenges in very high speed designs, from die pads, to packaging, to interconnect on the PCB. We
have the SI and design expertise, and tools in place to approach the entire interconnect as a system, and produce very high quality cutting
• With in-house material procurement, our engineering team has real time access to component pricing and availability information.